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4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board

Qingdao Kerongda Tech Co.,Ltd.
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    Buy cheap 4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board from wholesalers
     
    Buy cheap 4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board from wholesalers
    • Buy cheap 4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board from wholesalers

    4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board

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    Brand Name : kerongda
    Certification : CE
    Model Number : KRD-PCBA01
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    4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board

    PCBA/PCB/OEM/Control board

    SMT basic process elements include:

    screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, testing, repair

    1. Screen printing: Its function is to leak solder paste or patch glue onto the PCB pad to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), located at the front end of the SMT line.

    2, dispensing: it is to drop the glue to the fixed position of the PCB board, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.


    DIP

    1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.


    2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.


    Our Advantages:

    1. Program and functional test and package by Free.

    2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.

    3. Professional service: PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, OEM with 21 years experience.

    4. Certifications: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001,IATF16949


    No.Types Of AssemblyFile FormatComponent FootprinrComponent PackageTesting ProduresProduresOthers
    1SMT ASSEMBLYGerber RS-274X0201,0402,0603...Reels PackageVisual InspectionLead-Free(Rohs)Custom Reflow Profile
    2SMT & THT AssemblyBOM(.xls,.csv,.xlsx)BGA,QFN,QFP,PLCCCut Tape PackageX-Ray InspectionLeaded SolderStandard Reflow Profile
    32 sided SMT,THT AssemblyPick-N-Place/XY fileSOIC,POP...ConnectorsTube and TrayAOI,ICT(In-Circuit Test)Reflow SolderingSmallest Size:0.2"x0.2"
    4Mixed Assembly...Small Pitch of 8 MilsLoose parts and bulkFunctional TestingWave SolderingLargest Size:15"x"20

    4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board

    4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board4 Layer Through Hole Pcb Assembly Process Through Hole Circuit Board

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